HSM2694 |
RFQ for HSM2694 |
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| Product | Manufacturers | Pack | D/C |
| HSM2694 | - | SOT-23 | - |
Features |
| · Low forward resistance. (rf = 0.9 max)· Low capacitance. (C = 1.2pFmax)· MPAK package is suitable for high density surface mounting and high speed assembly. |
|
Item |
Symbol |
Value |
Unit |
| Reverse voltage |
VR |
35 |
V |
| Power dissipation |
PD* |
150 |
mW |
| Junction temperature |
Tj |
125 |
|
| Storage temperature |
Tstg |
45 to +125 |
|
| Operation temperature |
Topr |
20 to +60 |